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The SM411 has achieved the highest placement speed of 42,000 CPH for chips and 30,000 CPH for SOP parts (based on IPC, respectively) in the world among machines of the same class by adopting a dual gantry mechanism and On-The-Fly method, for which Samsung registered patents.
In addition, by implementing high accuracy placement of 50 microns at high speed, it allows placement of parts from the smallest 0402(01005) chip to □14mm IC part. In the aspect of PCB applicability, it allows simultaneous feeding of 2 L460 x W250 PCBs, increasing actual productivity.
It also supports the production of L610mm long board for display as an option.
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